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Thickly plated substrate Product List

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Thick-plated board with through holes (TH)

Recently, there has been an increasing demand for a certain thickness even outside of automotive applications!

We would like to introduce the "Through-Hole (TH) Thick Plated Board" handled by Matsuwa Sangyo Co., Ltd. The typical copper plating thickness required for Through-Holes (TH) is generally around 15 to 20 μm. However, to enhance reliability, there has been an increasing demand for a certain thickness (TH plating ≧ 25 μm) even for applications outside of automotive use. Please feel free to contact us when you need assistance. 【Manufacturing Specifications Example for Through-Hole (TH) Thick Plated Board】 ■ TH plating thickness: Capable of supporting TH thickness ≧ 25 μm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Thickly plated substrate

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